The BCM4322, the newest member of the Broadcom Intensi-fi family, is a full-featured, single-chip IEEE 802.11n solution. The highly integrated chip is the first to enable Wi-Fi products to achieve over 200 Mbits/s of actual wireless throughput, according to Broadcom. The chip combines an 802.11 medium access controller, a baseband processor, 2.4- and 5-GHz radios, and other WLAN components onto one silicon die. This high level of integration can reduce manufacturing costs by up to 40%. In addition, the smaller footprint allows designers to add Wireless LAN capabilities to consumer products that have never had such functionality, including televisions, set-top boxes, and camcorders. This will allow users to seamlessly move video and audio content throughout their home or office.

The use of a 65-nm process technology creates a chip that is less than half the size of multi-chip 802.11n solutions and consumes up to 50% less power. The chip is the second generation of Intesi-fi technology and complies with 802.11n draft 2.0. It uses a unique architecture that delivers a maximum data rate of 300 Mbits/s. It also employs innovative techniques to increase the reliability of wireless connections, as well as the network’s coverage area.